Company Filing History:
Years Active: 2020-2021
Title: Innovations by Inventor Jen-Chuan Chen
Introduction
Jen-Chuan Chen is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor technology. With a total of 2 patents, his work focuses on enhancing the performance and efficiency of semiconductor packages.
Latest Patents
One of his latest patents is titled "Semiconductor package including EMI shielding structure and method for forming the same." This invention provides a semiconductor package structure that includes an encapsulating layer, a package substrate, and a conductive shielding layer. The package substrate features a device region covered by the encapsulating layer and an edge region that surrounds the device region. The conductive shielding layer is designed to cover and surround the encapsulating layer while being electrically connected to the conductors.
Another significant patent by Chen is "Semiconductor package with improved heat dissipation." This patent describes a semiconductor package that consists of a package substrate with a top and bottom surface, an interposer mounted on the top surface, and two semiconductor dies mounted side-by-side on the interposer. A stiffener ring encircles the semiconductor dies, providing enhanced structural integrity and heat dissipation.
Career Highlights
Jen-Chuan Chen is currently employed at MediaTek Corporation, a leading company in semiconductor technology. His work at MediaTek has allowed him to develop innovative solutions that address the challenges faced in the semiconductor industry.
Collaborations
Throughout his career, Chen has collaborated with talented individuals such as Wen-Sung Hsu and Tai-Yu Chen. These collaborations have contributed to the advancement of semiconductor technologies and have fostered a creative environment for innovation.
Conclusion
Jen-Chuan Chen's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the development of efficient and effective semiconductor packages.