The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Jul. 28, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Lara Hawrylchak, Gilroy, CA (US);

Samuel C. Howells, Portland, OR (US);

Wolfgang R. Aderhold, Cupertino, CA (US);

Leonid M. Tertitski, Vista, CA (US);

Michael Liu, Saratoga, CA (US);

Dongming Iu, Union City, CA (US);

Norman L. Tam, Cupertino, CA (US);

Ji-Dih Hu, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01J 5/00 (2006.01); H01L 21/324 (2006.01); G05D 23/19 (2006.01); H01L 21/66 (2006.01); H05B 1/02 (2006.01); G01J 5/60 (2006.01); H01L 21/687 (2006.01); H05B 3/00 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
G01J 5/0007 (2013.01); G01J 5/602 (2013.01); G05D 23/1931 (2013.01); H01L 21/324 (2013.01); H01L 21/67109 (2013.01); H01L 21/67115 (2013.01); H01L 21/68735 (2013.01); H01L 22/10 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01); H05B 1/0233 (2013.01); H05B 3/0047 (2013.01); G01J 2005/0051 (2013.01);
Abstract

Examples described herein generally relate to apparatus and methods for rapid thermal processing (RTP) of a substrate. In one example, a process chamber includes chamber body, a window disposed on a first portion of the chamber body, a chamber bottom, and a shield disposed on a second portion of the chamber body. The shield has a flat surface facing the window to reduce reflected radiant energy to a back side of a substrate disposed in the process chamber during operation. The process chamber further includes an edge support for supporting the substrate and a cooling member disposed on the chamber bottom. The cooling member is disposed in proximity of the edge support to cool the edge support during low temperature operation in order to improve the temperature uniformity of the substrate.


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