The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Nov. 06, 2018
Applicant:

Rohm and Haas Electronic Materials Cmp Holdings, Inc., Newark, DE (US);

Inventors:

Matthew R. Gadinski, Newark, DE (US);

Mohammad T. Islam, New Castle, DE (US);

Yi Guo, Newark, DE (US);

George C. Jacob, Newark, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); B24B 37/24 (2012.01); H01L 21/306 (2006.01); H01L 21/3105 (2006.01); C09G 1/02 (2006.01); C08G 18/48 (2006.01); C08G 18/32 (2006.01); C08G 18/66 (2006.01); C08G 18/76 (2006.01); C08G 18/18 (2006.01); C08G 18/10 (2006.01); H01L 21/768 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
B24B 37/24 (2013.01); C08G 18/10 (2013.01); C08G 18/1875 (2013.01); C08G 18/3243 (2013.01); C08G 18/4854 (2013.01); C08G 18/6685 (2013.01); C08G 18/7664 (2013.01); C09G 1/02 (2013.01); H01L 21/30625 (2013.01); H01L 21/31053 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01);
Abstract

The present invention concerns a chemical mechanical polishing pad having a polishing layer that possesses a consistent positive zeta potential across the entire surface. Also disclosed is a chemical mechanical polishing method using the polishing pad together with a positively charged slurry.


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