The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

Aug. 31, 2018
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yu Nagatomo, Miyagi, JP;

Yoshihide Kihara, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01J 37/32 (2006.01); H01L 21/033 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31144 (2013.01); H01J 37/32091 (2013.01); H01J 37/32724 (2013.01); H01L 21/0332 (2013.01); H01L 21/0337 (2013.01); H01L 21/28568 (2013.01); H01L 21/31116 (2013.01); H01J 2237/002 (2013.01); H01J 2237/334 (2013.01); H01J 2237/3321 (2013.01);
Abstract

An etching method can protect a mask with a material having higher etching resistance to a silicon-containing film. The etching method is performed in a state that a processing target object is placed within a chamber main body. The etching method includes forming a tungsten film on the processing target object and etching the silicon-containing film of the processing target object. The forming of the tungsten film includes supplying a gaseous tungsten-containing precursor onto the processing target object; and generating plasma of a hydrogen gas to supply active species of hydrogen to the precursor on the processing target object. In the etching of the silicon-containing film, plasma of a processing gas containing fluorine, hydrogen and carbon is generated within the chamber main body.


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