The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2020
Filed:
Mar. 03, 2017
Tokyo Electron Limited, Tokyo, JP;
Tohoku University, Sendai-shi, Miyagi, JP;
Shinya Kikuta, Nirasaki, JP;
Satohiko Hoshino, Nirasaki, JP;
Takafumi Fukushima, Sendai, JP;
Mitsumasa Koyanagi, Sendai, JP;
Kangwook Lee, Sendai, JP;
TOKYO ELECTRON LIMITED, Tokyo, JP;
TOHOKU UNIVERSITY, Sendai-Shi, Miyagi, JP;
Abstract
A liquid is supplied to a substrate and a chip component is arranged on the liquid. The substrate includes a first surface in which a rectangular mounting region is formed. The chip component includes a second surface having a rectangular shape which substantially coincides with the shape of the mounting region, and has an area substantially equal to that of the mounting region. The mounting region includes first and second regions. Wettability of the first region with respect to the liquid is higher than that of the second region with respect to the liquid. The first region is provided symmetrically with respect to a first central line passing through the middle of a pair of long sides and a second central line passing through the middle of a pair of short sides in the mounting region, and includes rectangular partial regions. The liquid is supplied to the first region.