The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Oct. 26, 2018
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Hideomi Hane, Nirasaki, JP;

Kentaro Oshimo, Nirasaki, JP;

Shimon Otsuki, Oshu, JP;

Takeshi Oyama, Niraskai, JP;

Hiroaki Ikegawa, Nirasaki, JP;

Jun Ogawa, Nirasaki, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/34 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01); H01L 21/02 (2006.01); H01L 21/687 (2006.01); C23C 16/46 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45544 (2013.01); C23C 16/345 (2013.01); C23C 16/4584 (2013.01); C23C 16/45536 (2013.01); C23C 16/45565 (2013.01); C23C 16/46 (2013.01); H01L 21/0217 (2013.01); H01L 21/0228 (2013.01); H01L 21/02274 (2013.01); H01L 21/68764 (2013.01);
Abstract

There is provided a film forming apparatus for performing a film forming process by supplying a film forming gas to a substrate in a vacuum atmosphere, comprising: a processing container in which a mounting part for mounting a substrate thereon is provided; a heating part configured to heat the substrate mounted on the mounting part; an exhaust part configured to evacuate an inside of the processing container; a cooling gas supply part configured to supply a cooling gas into the processing container; a purge gas supply part configured to supply a purge gas into the processing container; and a control part configured to output a control signal so as to execute a step of applying a stress to a thin film formed inside the processing container.


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