The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2020

Filed:

Aug. 02, 2018
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Daiki Komatsu, Beppu, JP;

Makoto Shibuya, Beppu, JP;

Yi Yan, Milpitas, CA (US);

Hau Nguyen, San Jose, CA (US);

Luu Thanh Nguyen, San Jose, CA (US);

Anindya Poddar, Sunnyvale, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 21/4825 (2013.01); H01L 21/4853 (2013.01); H01L 21/4882 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/3114 (2013.01); H01L 23/3675 (2013.01); H01L 23/4951 (2013.01); H01L 23/49838 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/1145 (2013.01); H01L 2224/1191 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11515 (2013.01); H01L 2224/11618 (2013.01); H01L 2224/13008 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16157 (2013.01); H01L 2224/16175 (2013.01);
Abstract

Described examples provide integrated circuits and methods, including forming a conductive seed layer at least partially above a conductive feature of a wafer, forming a conductive structure on at least a portion of the conductive seed layer, performing a printing process that forms a polymer material on a side of the wafer proximate a side of the conductive structure, curing the deposited polymer material, and attaching a solder ball structure to a side of the conductive structure.


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