The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2020
Filed:
May. 23, 2017
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Myung-ki Hong, Anyang-si, KR;
Yung-jun Kim, Yongin-si, KR;
Sung-oh Park, Suwon-si, KR;
Hyo-san Lee, Hwaseong-si, KR;
Joo-han Lee, Seongnam-si, KR;
Kyu-min Oh, Suwon-si, KR;
Sun-gyu Park, Seoul, KR;
Seh-kwang Lee, Yongin-si, KR;
Chan-ki Yang, Hwaseong-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do, KR;
EHWA Diamond Industrial Co., Ltd., Osan-si, Gyeonggi-do, KR;
Abstract
A chemical mechanical polishing (CMP) method includes preparing a polishing pad, determining a first load to be applied to a conditioning disk during conditioning of the polishing pad and a first indentation depth at which tips of the conditioning disk are inserted into the polishing pad when the first load is applied to the conditioning disk, preparing a conditioning disk, and positioning the conditioning disk on the polishing pad and conditioning a surface of the polishing pad by using the conditioning disk while applying the first load to the conditioning disk.