Yongin-si, South Korea

Yung-jun Kim


Average Co-Inventor Count = 9.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2020

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Yung-jun Kim: Innovator in Chemical Mechanical Polishing

Introduction

Yung-jun Kim is a notable inventor based in Yongin-si, South Korea. He has made significant contributions to the field of chemical mechanical polishing (CMP), a critical process in semiconductor manufacturing. His innovative approach has led to advancements that enhance the efficiency and effectiveness of CMP methods.

Latest Patents

Yung-jun Kim holds a patent for a method titled "Preparing conditioning disk for chemical mechanical polishing and chemical mechanical polishing method including the same." This patent outlines a CMP method that involves preparing a polishing pad, determining specific loads and indentation depths for a conditioning disk, and conditioning the surface of the polishing pad. His invention aims to improve the performance and longevity of polishing pads used in semiconductor fabrication.

Career Highlights

Throughout his career, Yung-jun Kim has worked with prominent companies in the industry. He has been associated with Samsung Electronics Co., Ltd. and Ehwa Diamond Industrial Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to significant advancements in CMP technology.

Collaborations

Yung-jun Kim has collaborated with several professionals in his field, including Myung-ki Hong and Sung-oh Park. These collaborations have fostered innovation and have been instrumental in the development of new techniques and methods in chemical mechanical polishing.

Conclusion

Yung-jun Kim's contributions to the field of chemical mechanical polishing demonstrate his commitment to innovation and excellence. His patent and career achievements reflect his expertise and the impact he has made in the semiconductor industry.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…