The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2019
Filed:
Oct. 17, 2013
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Shao-Yu Chen, Tainan, TW;
Chih-Ping Chao, Hsinchu, TW;
Chun-Hung Chen, Hsinchu County, TW;
Chung-Long Chang, Yun Lin, TW;
Kuan-Chi Tsai, Kaohsiung, TW;
Wei-Kung Tsai, Tainan, TW;
Hsiang-Chi Chen, Taichung, TW;
Ching-Chung Hsu, Taichung, TW;
Cheng-Chang Hsu, Hsinchu County, TW;
Yi-Sin Wang, Tainan, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
An integrated circuit includes a stacked MIM capacitor and a thin film resistor and methods of fabricating the same are disclosed. A capacitor bottom metal in one capacitor of the stacked MIM capacitor and the thin film resistor are substantially at the same layer of the integrated circuit, and the capacitor bottom metal and the thin film resistor are also made of substantially the same materials. The integrated circuit with both of a stacked MIM capacitor and a thin film resistor can be made in a cost benefit way accordingly, so as to overcome disadvantages mentioned above.