The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2019
Filed:
Sep. 16, 2016
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Shich-Chang Suen, Hsinchu, TW;
Chi-Jen Liu, Taipei, TW;
Ying-Liang Chuang, Hsinchu, TW;
Li-Chieh Wu, Hsinchu, TW;
Liang-Guang Chen, Hsinchu, TW;
Ming-Liang Yen, Taipei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsin-Chu, TW;
Abstract
A chemical mechanical polishing (CMP) system includes an O/DIW generator, a polishing unit, and a cleaning unit. The O/DIW generator is configured to generate an O/DIW solution including ozone gas (O) dissolved in deionized water (DIW). The polishing unit includes components for buffing a surface of a semiconductor structure, and a pipeline coupled to the O/DIW generator to receive the O/DIW solution for the buffing. The cleaning unit is coupled to the O/DIW generator and is configured to clean the surface of the semiconductor structure using the O/DIW solution.