The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Jun. 05, 2018
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Chih-Teng Liao, Hsinchu, TW;

Chih-Shan Chen, New Taipei, TW;

Yi-Wei Chiu, Kaohsiung, TW;

Chih Hsuan Cheng, Miaoli County, TW;

Tzu-Chan Weng, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 21/8234 (2006.01); H01L 21/324 (2006.01); H01L 29/78 (2006.01); H01L 29/417 (2006.01); H01L 29/08 (2006.01); H01L 21/306 (2006.01); H01L 21/8238 (2006.01); H01L 27/092 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/6681 (2013.01); H01L 21/30625 (2013.01); H01L 21/324 (2013.01); H01L 21/823418 (2013.01); H01L 21/823431 (2013.01); H01L 21/823814 (2013.01); H01L 21/823842 (2013.01); H01L 27/092 (2013.01); H01L 29/0653 (2013.01); H01L 29/0847 (2013.01); H01L 29/41791 (2013.01); H01L 29/66545 (2013.01); H01L 29/785 (2013.01); H01L 29/7848 (2013.01);
Abstract

A method includes forming a fin structure on the substrate, wherein the fin structure includes a first fin active region; a second fin active region; and an isolation feature separating the first and second fin active regions; forming a first gate stack on the first fin active region and a second gate stack on the second fin active region; performing a first recessing process to a first source/drain region of the first fin active region by a first dry etch; performing a first epitaxial growth to form a first source/drain feature on the first source/drain region; performing a fin sidewall pull back (FSWPB) process to remove a dielectric layer on the second fin active region; and performing a second epitaxial growth to form a second source/drain feature on a second source/drain region of the second fin active region.


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