The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2019
Filed:
Oct. 04, 2017
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Weiming Chris Chen, Taipei, TW;
Tu-Hao Yu, Hsin-Chu, TW;
Kuo-Chiang Ting, Hsinchu, TW;
Shang-Yun Hou, Hsinchu, TW;
Chi-Hsi Wu, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor device includes a first electronic component, a second electronic component and a plurality of interconnection structures. The first electronic component has a first surface. The second electronic component is over the first electronic component, and the second electronic component has a second surface facing the first surface of the first electronic component. The interconnection structures are between and electrically connected to the first electronic component and the second electronic component, wherein each of the interconnection structures has a length along a first direction substantially parallel to the first surface and the second surface, a width along a second direction substantially parallel to the first surface and the second surface and substantially perpendicular to the first direction, and the length is larger than the width of at least one of the interconnection structures.