The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2019
Filed:
Jul. 31, 2018
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/05 (2006.01); H01L 23/31 (2006.01); H01B 3/08 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/056 (2013.01); H01B 3/084 (2013.01); H01L 23/3114 (2013.01); H05K 1/032 (2013.01); H05K 1/036 (2013.01); H05K 1/0313 (2013.01); H05K 1/0353 (2013.01); H05K 1/11 (2013.01); H05K 1/0284 (2013.01); H05K 1/0366 (2013.01); H05K 1/0373 (2013.01); H05K 2201/0275 (2013.01);
Abstract
Generally, the present disclosure provides example embodiments relating to a printed circuit board (PCB). In an embodiment, a structure includes a PCB including insulating layers with respective metal layers being disposed therebetween. Each of first layers of the insulating layers includes a first fiberglass content. A second layer of the insulating layers has a second fiberglass content less than the first fiberglass content. For example, in some embodiments, the second insulating layer does not include a fiberglass matrix.