The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2019
Filed:
Dec. 21, 2017
Fei Company, Hillsboro, OR (US);
Tomá{hacek over (s)} Vystav{hacek over (e)}l, Brno, CZ;
Libor Strako{hacek over (s)}, Brno, CZ;
Anna Prokhodtseva, Eindhoven, NL;
Jaromir Va{hacek over (n)}hara, Brno, CZ;
Jaroslav Stárek, Hronov, CZ;
FEI Company, Hillsboro, OR (US);
Abstract
A substrate is alignable for ion beam milling or other inspection or processing by obtaining an electron channeling pattern (ECP) or other electron beam backscatter pattern from the substrate based on electron beam backscatter from the substrate. The ECP is a function of substrate crystal orientation and tilt angles associated with ECP pattern values at or near a maximum, minimum, or midpoint are used to determine substrate tilt. Such tilt is then compensated or eliminated using a tilt stage coupled the substrate, or by adjusting an ion beam axis. In typical examples, circuit substrate 'chunks' are aligned for ion beam milling to reveal circuit features for evaluation of circuit processing.