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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10497646 B1

PDFFull Text
Date of Patent:
Dec. 03, 2019

Filed:

Jul. 28, 2016

Dual-mode wireless charging device

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Shih-Wei Liang, Dajia Township, Taichung County, TW;

Hung-Yi Kuo, Taipei, TW;

Hao-Yi Tsai, Hsinchu, TW;

Ming-Hung Tseng, Toufen Township, Miaoli County, TW;

Hsien-Ming Tu, Zhubei, TW;

Assignee:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Attorney:

Duane Morris LLP

Primary Examiner:

Mang Tin Bik Lian

Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01L 23/522 (2006.01); H02J 50/12 (2016.01); H01L 23/31 (2006.01); H01L 23/528 (2006.01); H01L 49/02 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01L 23/3157 (2013.01); H01L 23/49822 (2013.01); H01L 23/528 (2013.01); H01L 23/5223 (2013.01); H01L 23/5226 (2013.01); H01L 23/66 (2013.01); H01L 28/10 (2013.01); H01L 28/40 (2013.01); H02J 50/12 (2016.02); H01L 23/5389 (2013.01); H01L 24/20 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6672 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/24195 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A semiconductor device includes a first molding layer; a second molding layer formed over the first molding layer; a first conductive coil including a first portion continuously formed in the first molding layer and a second portion continuously formed in the second molding layer, wherein the first and the second portions are laterally displaced from each other; and a second conductive coil formed in the second molding layer, wherein the second conductive coil is interweaved with the second portion of the first conductive coil in the second molding layer.

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