The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2019

Filed:

Mar. 12, 2017
Applicant:

Globalwafers Co., Ltd., Hsinchu, TW;

Inventors:

Yen-Lun Huang, Hsinchu, TW;

Chien-Jen Sun, Hsinchu, TW;

Ying-Ru Shih, Hsinchu, TW;

Wen-Ching Hsu, Hsinchu, TW;

Assignee:

GlobalWafers Co., Ltd., Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/673 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67383 (2013.01); H01L 21/68735 (2013.01); H01L 21/68764 (2013.01); H01L 21/68771 (2013.01);
Abstract

A wafer carrier for processing a plurality of wafers includes a carrier body which rotatable about a central axis, and a plurality of pockets formed in the carrier body. Each of the pockets has an access opening and an inner periphery surface extending from the access opening to terminate at a floor surface. A lower periphery region of the inner periphery surface has a most distal region which is most distal from the central axis. When the carrier body is rotated about the central axis, a corresponding one of the wafers is less likely to be damaged due to a centrifugal force applied to the corresponding one of the wafers.


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