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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10483617 B1

PDFFull Text
Date of Patent:
Nov. 19, 2019

Filed:

Jan. 25, 2018

Package structure

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Nan-Chin Chuang, Taipei, TW;

Chen-Hua Yu, Hsinchu, TW;

Chung-Shi Liu, Hsinchu, TW;

Chao-Wen Shih, Hsinchu County, TW;

Shou-Zen Chang, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Hai V Tran

Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 23/66 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/552 (2006.01); H01Q 21/00 (2006.01); H01Q 21/24 (2006.01); H01Q 1/52 (2006.01); H01Q 19/30 (2006.01); H01Q 15/14 (2006.01); H01Q 21/28 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 23/3107 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/13 (2013.01); H01Q 1/526 (2013.01); H01Q 19/30 (2013.01); H01Q 21/0087 (2013.01); H01Q 21/24 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05024 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/18 (2013.01); H01L 2924/19102 (2013.01); H01L 2924/3025 (2013.01); H01Q 15/14 (2013.01); H01Q 21/28 (2013.01);
Abstract

A package structure including an insulating encapsulation, at least one semiconductor die, at least one first antenna and at least one second antenna is provided. The insulating encapsulation includes a first portion, a second portion and a third portion, wherein the second portion is located between the first portion and the third portion. The at least one semiconductor die is encapsulated in the first portion of the insulating encapsulation, and the second portion and the third portion are stacked on the at least one semiconductor die. The at least one first antenna is electrically connected to the at least one semiconductor die and encapsulated in the third portion of the insulating encapsulation. The at least one second antenna is electrically connected to the at least one semiconductor die and encapsulated in the second portion of the insulating encapsulation.

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