The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Jul. 27, 2017
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Yen-Wei Tung, Tainan, TW;

Jen-Yu Wang, Tainan, TW;

Cheng-Tung Huang, Kaohsiung, TW;

Yan-Jou Chen, Yunlin County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/092 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 29/78 (2006.01); H01L 29/49 (2006.01); H01L 29/51 (2006.01); H01L 29/423 (2006.01); H01L 29/165 (2006.01); H01L 21/8238 (2006.01); H01L 21/3213 (2006.01); H01L 21/762 (2006.01); H01L 21/02 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0924 (2013.01); H01L 21/0217 (2013.01); H01L 21/32139 (2013.01); H01L 21/76224 (2013.01); H01L 21/823821 (2013.01); H01L 21/823842 (2013.01); H01L 21/823878 (2013.01); H01L 27/0207 (2013.01); H01L 27/0922 (2013.01); H01L 29/0649 (2013.01); H01L 29/66545 (2013.01); H01L 29/7848 (2013.01); H01L 29/165 (2013.01); H01L 29/42364 (2013.01); H01L 29/42376 (2013.01); H01L 29/4916 (2013.01); H01L 29/4966 (2013.01); H01L 29/517 (2013.01); H01L 29/518 (2013.01);
Abstract

A method for fabricating semiconductor device includes the steps of: forming a first fin-shaped structure on a substrate; forming a first single diffusion break (SDB) structure in the first fin-shaped structure; forming a first gate structure on the first SDB structure and a second gate structure on the first fin-shaped structure; forming an interlayer dielectric (ILD) layer around the first gate structure and the second gate structure; forming a patterned mask on the first gate structure; and performing a replacement metal gate (RMG) process to transform the second gate structure into a metal gate.


Find Patent Forward Citations

Tung, Yen-Wei. (2019). Finfet cmos device including single diffusion break in each of nmos and pmos regions (U.S. Patent No. 10483264). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10483264

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…