The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Jun. 25, 2018
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

De-Wei Yu, Ping-Tung, TW;

Chia Ping Lo, Jhubei, TW;

Liang-Gi Yao, Shin Chu, TW;

Weng Chang, Hsin-Chu, TW;

Yee-Chia Yeo, Hsinchu, TW;

Ziwei Fang, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/268 (2006.01); H01L 21/324 (2006.01); H01L 21/8234 (2006.01); H01L 21/8238 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823821 (2013.01); H01L 21/02532 (2013.01); H01L 21/02592 (2013.01); H01L 21/268 (2013.01); H01L 21/324 (2013.01); H01L 21/3247 (2013.01); H01L 21/823431 (2013.01); H01L 21/823481 (2013.01); H01L 21/823828 (2013.01); H01L 21/823878 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01);
Abstract

A method includes providing a substrate including a first fin element and a second fin element extending from the substrate. A first layer including an amorphous material is formed over the first and second fin elements, where the first layer includes a gap disposed between the first and second fin elements. An anneal process is performed to remove the gap in the first layer. The amorphous material of the first layer remains amorphous during the performing of the anneal process.


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