The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2019
Filed:
Aug. 15, 2017
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Wei-Barn Chen, Tainan, TW;
Ting-Huang Kuo, Tainan, TW;
Shiu-Ko Jangjian, Tainan, TW;
Chi-Cherng Jeng, Tainan, TW;
Kuang-Yao Lo, Tainan, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
In a method for manufacturing a semiconductor device, a substrate is provided. A hard mask and a mask layer are formed on a first region and a second region of the substrate. The substrate is recessed using the hard mask and the mask layer to form a fin structure in the first region and a raised structure in the second region. First isolation structures and second isolation structures are formed on lower portions of opposite sidewalls of the fin structure and opposite sidewalls of the raised structure. A first gate structure is formed on a portion of the fin structure, and a second gate structure is formed on a portion of the raised structure. A first source and a first drain are formed on opposite sides of the first gate structure, and a second source and a second drain are formed on opposite sides of the second gate structure.