The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2019
Filed:
Nov. 20, 2017
Applicant:
Phoenix Pioneer Technology Co., Ltd., Hsinchu County, TW;
Inventors:
Shih-Ping Hsu, Hsinchu County, TW;
Che-Wei Hsu, Hsinchu County, TW;
Ching-Chieh Chang, Hsinchu County, TW;
Chao-Chung Tseng, Hsinchu County, TW;
Assignee:
PHOENIX PIONEER TECHNOLOGY CO., LTD., Hsinchu County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/97 (2013.01); H01L 23/498 (2013.01); H01L 24/42 (2013.01); H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/80904 (2013.01); H01L 2924/051 (2013.01); H01L 2924/181 (2013.01); H01L 2924/351 (2013.01);
Abstract
The disclosure provides an interposer substrate and a method for manufacturing the same. The method includes forming an insulating protection layer having a phosphorus compound on a substrate body, thereby providing toughness and strength as required when the thickness of the interposer substrate becomes too thin, and preventing substrate warpage when the substrate has a shrinkage stress or structural asymmetries.