The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

Mar. 28, 2019
Applicant:

Carl Zeiss Smt Gmbh, Oberkochen, DE;

Inventors:

Alireza Akbarinia, Heidenheim, DE;

Alexandre Kemp, Ludwigshafen am Rhein, DE;

Timo Laufer, Stuttgart, DE;

Amishkumar Panchal, Aalen, DE;

Assignee:

Carl Zeiss SMT GmbH, Oberkochen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70775 (2013.01); G03F 7/708 (2013.01); G03F 7/709 (2013.01); G03F 7/7095 (2013.01); G03F 7/70766 (2013.01); G03F 7/70825 (2013.01); G03F 7/70833 (2013.01); G03F 7/70858 (2013.01); G03F 7/70891 (2013.01);
Abstract

A projection exposure apparatus for semiconductor lithography includes: a light source for generating optical used radiation by which structures arranged on a reticle can be imaged onto a wafer; a plurality of optical elements for guiding and manipulating the used radiation; and a plurality of position sensors for determining the position of at least some of the optical elements. At least some of the position sensors are arranged on a measurement structure that is at least partially decoupled mechanically and/or thermally from the further components of the projection exposure apparatus. The measurement structure has at least two mechanically decoupled substructures. The first substructure has a lower coefficient of thermal expansion than the second substructure. The second substructure has a greater stiffness than the first substructure.


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