The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2019
Filed:
Dec. 05, 2016
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Chen-Hua Yu, Hsin-Chu, TW;
Hao-Yi Tsai, Hsin-Chu, TW;
Chien-Hsiun Lee, Hsin-Chu, TW;
Chung-Shi Liu, Hsin-Chu, TW;
Hsien-Wei Chen, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Methods and apparatus for solder connections. An apparatus includes a substrate having a conductive terminal on a surface; a passivation layer overlying the surface of the substrate and the conductive terminal; an opening in the passivation layer exposing a portion of the conductive terminal; at least one stud bump bonded to the conductive terminal in the opening and extending in a direction normal to the surface of the substrate; and a solder connection formed on the conductive terminal in the opening and enclosing the at least one stud bump. Methods for forming the solder connections are disclosed.