The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Aug. 25, 2017
Applicants:

John Wuu, Fort Collins, CO (US);

Samuel Naffziger, Fort Collins, CO (US);

Patrick J. Shyvers, Fort Collins, CO (US);

Milind S. Bhagavat, Los Altos, CA (US);

Kaushik Mysore, Austin, TX (US);

Brett P. Wilkerson, Austin, TX (US);

Inventors:

John Wuu, Fort Collins, CO (US);

Samuel Naffziger, Fort Collins, CO (US);

Patrick J. Shyvers, Fort Collins, CO (US);

Milind S. Bhagavat, Los Altos, CA (US);

Kaushik Mysore, Austin, TX (US);

Brett P. Wilkerson, Austin, TX (US);

Assignee:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 23/36 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 23/373 (2013.01); H01L 23/3732 (2013.01); H01L 23/3736 (2013.01); H01L 23/3737 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01);
Abstract

Various semiconductor chip devices with stacked chips are disclosed. In one aspect, a semiconductor chip device is provided. The semiconductor chip device includes a first semiconductor chip that has a floor plan with a high heat producing area and a low heat producing area. At least one second semiconductor chip is stacked on the low heat producing area. The semiconductor chip device also includes means for transferring heat from the high heat producing area.


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