The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Nov. 28, 2017
Applicant:

Hoya Corporation, Shinjuku-ku, Tokyo, JP;

Inventors:

Kazuhiro Hamamoto, Tokyo, JP;

Toshihiko Orihara, Tokyo, JP;

Hirofumi Kozakai, Tokyo, JP;

Youichi Usui, Tokyo, JP;

Tsutomu Shoki, Tokyo, JP;

Junichi Horikawa, Tokyo, JP;

Assignee:

HOYA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 1/22 (2012.01); G03F 1/60 (2012.01); G03F 1/50 (2012.01); G03F 7/20 (2006.01); H01L 21/033 (2006.01);
U.S. Cl.
CPC ...
G03F 1/22 (2013.01); G03F 1/50 (2013.01); G03F 1/60 (2013.01); G03F 7/2004 (2013.01); H01L 21/0332 (2013.01); H01L 21/0334 (2013.01);
Abstract

Disclosed is a mask blank substrate for use in lithography, wherein a main surface of the substrate satisfies a relational equation of (BA−BA)/(BD−BD)≥350 (%/nm), and has a maximum height (Rmax)≤1.2 nm in a relation between a bearing area (%) and a bearing depth (nm) obtained by measuring, with an atomic force microscope, an area of 1 μm×1 μm in the main surface on the side of the substrate where a transfer pattern is formed, wherein BAis defined as a bearing area of 30%, BAis defined as a bearing area of 70%, and BDand BDare defined to respectively represent bearing depths for the bearing area of 30% and the bearing area of 70%.


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