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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10396036 B1

PDFFull Text
Date of Patent:
Aug. 27, 2019

Filed:

Dec. 26, 2015

Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contacts and contact pins of package devices

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Yu Amos Zhang, Santa Clara, CA (US);

Zhiguo Qian, Chandler, AZ (US);

Kemal Aygun, Chandler, AZ (US);

Yidnekachew S. Mekonnen, Chandler, AZ (US);

Gregorio R. Murtagian, Phoenix, AZ (US);

Sanka Ganesan, Chandler, AZ (US);

Eduard Roytman, Newton Centre, MA (US);

Jeff C. Morriss, Los Gatos, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Schwabe, Williamson & Wyatt, P.C.

Primary Examiner:

Kyoung Lee

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 23/48 (2013.01); H01L 23/49827 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 23/49838 (2013.01); H01L 23/50 (2013.01); H01L 25/0655 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A vertically ground isolated package device can include (1) ground shielding attachment structures and shadow voiding for data signal contacts; (2) vertical ground shielding structures and shield fencing of vertical data signal interconnects; and (3) ground shielding for an electro-optical module connector of the package device. These reduce cross talk between data signal contacts, attachment structures and vertical 'signal' interconnects of the package device. The ground shielding attachment structures may include patterns of solder bumps and/or surface contacts. The shadow voiding may be surrounding voids in ground planes that are larger than the data signal solder bumps. The vertical ground shielding structures may include patterns of ground shield interconnects between the vertical data signal interconnects: The shield fencing may include patterns of ground plated through holes (PTH) and micro-vias (uVia). The ground shielding for the electro-optical module may include patterns of ground isolation shielding attachments and contacts.

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