The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Feb. 14, 2018
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Ajay Gupta, Santa Clara, CA (US);

Mohan Mahadevan, Livermore, CA (US);

Sankar Venkataraman, Milpitas, CA (US);

Hedong Yang, Santa Clara, CA (US);

Laurent Karsenti, Rehovot, IL;

Yair Carmon, Stanford, CA (US);

Noga Bullkich, Brookline, MA (US);

Udy Danino, Givat Shmuel, IL;

Assignee:

KLA-Tencor Corp., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G06T 7/564 (2017.01); G01N 21/95 (2006.01); G01N 21/88 (2006.01); G01N 21/956 (2006.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); G01N 21/8851 (2013.01); G01N 21/9501 (2013.01); G01N 21/95607 (2013.01); G06T 7/564 (2017.01); G01N 2021/8887 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/20084 (2013.01); G06T 2207/30148 (2013.01);
Abstract

Methods and systems for detecting defects in patterns formed on a specimen are provided. One system includes one or more components executed by one or more computer subsystems, and the component(s) include first and second learning based models. The first learning based model generates simulated contours for the patterns based on a design for the specimen, and the simulated contours are expected contours of a defect free version of the patterns in images of the specimen generated by an imaging subsystem. The second learning based model is configured for generating actual contours for the patterns in at least one acquired image of the patterns formed on the specimen. The computer subsystem(s) are configured for comparing the actual contours to the simulated contours and detecting defects in the patterns formed on the specimen based on results of the comparing.


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