The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2019
Filed:
Sep. 08, 2015
Applicant:
Jsr Corporation, Minato-ku, JP;
Inventors:
Hitoshi Hamaguchi, Minato-ku, JP;
Kenrou Tanaka, Minato-ku, JP;
Kenzou Ookita, Minato-ku, JP;
Keisuke Kuriyama, Minato-ku, JP;
Assignee:
JSR CORPORATION, Minato-ku, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/44 (2006.01); H05K 3/00 (2006.01); G03F 7/20 (2006.01); B05D 3/06 (2006.01); B29C 59/16 (2006.01); C08J 7/00 (2006.01); G03F 7/039 (2006.01); C09D 129/10 (2006.01); C09D 133/10 (2006.01); C09D 133/14 (2006.01); C09D 133/16 (2006.01); C23C 16/56 (2006.01); H05K 3/12 (2006.01); G03F 7/004 (2006.01); G03F 7/18 (2006.01); G03F 7/24 (2006.01);
U.S. Cl.
CPC ...
C23C 16/44 (2013.01); B05D 3/06 (2013.01); B29C 59/16 (2013.01); C08J 7/00 (2013.01); C09D 129/10 (2013.01); C09D 133/10 (2013.01); C09D 133/14 (2013.01); C09D 133/16 (2013.01); C23C 16/56 (2013.01); G03F 7/0046 (2013.01); G03F 7/039 (2013.01); G03F 7/0392 (2013.01); G03F 7/18 (2013.01); G03F 7/20 (2013.01); G03F 7/24 (2013.01); H05K 3/0023 (2013.01); H05K 3/12 (2013.01); H05K 2201/0166 (2013.01);
Abstract
The present invention relates to: a method of producing a structure having a recessed pattern; a resin composition; a method of forming an electroconductive film; an electronic circuit; and an electronic device. The method of producing a structure having a recessed pattern includes the following steps (i) and (ii), and the recessed pattern has a film thickness that is thinner by 5% to less than 90% with respect to that of a coating film obtained in the step (i):