The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2019

Filed:

Nov. 09, 2016
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Khokan C. Paul, Cupertino, CA (US);

Jay D. Pinson, II, San Jose, CA (US);

Juan Carlos Rocha-Alvarez, San Carlos, CA (US);

Hari K. Ponnekanti, San Jose, CA (US);

Rupankar Choudhury, Bangalore, IN;

Shekhar Athani, Bangalore, IN;

Sandeep Kumpala, Bangalore, IN;

Hanish Kumar Panavalappil Kumarankutty, Bangalore, IN;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/673 (2006.01); H01L 21/687 (2006.01); G05B 19/04 (2006.01); G05B 19/401 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67253 (2013.01); G05B 19/041 (2013.01); G05B 19/401 (2013.01); H01L 21/67196 (2013.01); H01L 21/67201 (2013.01); H01L 21/67207 (2013.01); H01L 21/67389 (2013.01); H01L 21/67724 (2013.01); H01L 21/67775 (2013.01); H01L 21/68707 (2013.01); H01L 21/68764 (2013.01); G05B 2219/31459 (2013.01); G05B 2219/40066 (2013.01);
Abstract

Implementations of the present disclosure generally relate to an improved factory interface that is coupled to an on-board metrology housing configured for measuring film properties of a substrate. In one implementation, an apparatus comprises a factory interface, and a metrology housing removably coupled to the factory interface through a load port, the metrology housing comprises an on-board metrology assembly for measuring properties of a substrate to be transferred into the metrology housing.


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