The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Dec. 29, 2017
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Roman Baburske, Otterfing, DE;

Matteo Dainese, Villach, AT;

Peter Lechner, Holzkirchen, DE;

Hans-Joachim Schulze, Taufkirchen, DE;

Johannes Georg Laven, Taufkirchen, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/04 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01); H01L 29/423 (2006.01); H01L 29/739 (2006.01); H01L 29/861 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7393 (2013.01); H01L 29/0696 (2013.01); H01L 29/407 (2013.01); H01L 29/4238 (2013.01); H01L 29/42368 (2013.01); H01L 29/7395 (2013.01); H01L 29/7397 (2013.01); H01L 29/045 (2013.01); H01L 29/0619 (2013.01); H01L 29/1095 (2013.01); H01L 29/6634 (2013.01); H01L 29/66333 (2013.01); H01L 29/66348 (2013.01); H01L 29/7396 (2013.01); H01L 29/8613 (2013.01); H01L 2924/13055 (2013.01);
Abstract

According to an embodiment of a semiconductor device, the device includes first and second trenches formed in a semiconductor body and an electrode disposed in each of the trenches. One of the electrodes is a gate electrode, and the other electrode is electrically disconnected from the gate electrode. The semiconductor device further includes a semiconductor mesa between the trenches. The semiconductor mesa includes a separation region and at least one of a source region and a body region located in the semiconductor mesa. A drift zone is provided below the at least one of the source region and the body region. In the separation region, at least one of (i) a capacitive coupling between the gate electrode and the semiconductor mesa and (ii) a conductivity of majority charge carriers of the drift zone is lower than outside of the separation region.


Find Patent Forward Citations

Loading…