The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2019
Filed:
Jan. 28, 2014
Applicant:
Ulvac, Inc., Chigasaki-shi, JP;
Inventors:
Tetsushi Fujinaga, Chigasaki, JP;
Masahiro Matsumoto, Chigasaki, JP;
Makoto Arai, Chigasaki, JP;
Eriko Mase, Chigasaki, JP;
Harunori Iwai, Chigasaki, JP;
Koji Takahashi, Chigasaki, JP;
Atsuhito Ihori, Chigasaki, JP;
Assignee:
ULVAC, INC., Chigasaki-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/34 (2006.01); C23C 14/54 (2006.01); C23C 14/50 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); C23C 14/56 (2006.01); C23C 14/34 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
C23C 14/541 (2013.01); C23C 14/345 (2013.01); C23C 14/50 (2013.01); C23C 14/568 (2013.01); H01J 37/32009 (2013.01); H01J 37/3244 (2013.01); H01J 37/32697 (2013.01); H01J 37/32715 (2013.01); H01J 37/32724 (2013.01); H01J 37/34 (2013.01); H01J 37/3464 (2013.01); H01J 37/3497 (2013.01); H01L 21/67109 (2013.01); H01L 21/6838 (2013.01);
Abstract
A thin substrate processing device include a substrate processing unit configured to process a thin substrate, and a cooling unit configured to cool the thin substrate when the substrate processing unit is processing the thin substrate.