The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2019
Filed:
Mar. 22, 2018
Sandisk Technologies Llc, Plano, TX (US);
Mitsuteru Mushiga, Yokkaichi, JP;
Akio Nishida, Yokkaichi, JP;
Kenji Sugiura, Yokkaichi, JP;
Hisakazu Otoi, Yokkaichi, JP;
Masatoshi Nishikawa, Yokkaichi, JP;
SANDISK TECHNOLOGIES LLC, Addison, TX (US);
Abstract
Sacrificial pillar structures are formed through a first semiconductor substrate on which first semiconductor devices are subsequently formed. After backside thinning of the first semiconductor substrate, the sacrificial pillar structures are replaced with integrated through-substrate via and pad structures to provide a first semiconductor chip. A second semiconductor chip is provided, which includes a second semiconductor substrate, second semiconductor devices, and second bonding pad structures electrically connected to a respective one of the second semiconductor devices. The first bonding pad structures are bonded to a respective one of the second bonding pad structures by surface activated bonding.