The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Aug. 09, 2016
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Seshasayee Varadarajan, Lake Oswego, OR (US);

Aaron R. Fellis, San Jose, CA (US);

Andrew John McKerrow, Lake Oswego, OR (US);

James Samuel Sims, Tigard, OR (US);

Ramesh Chandrasekharan, Portland, OR (US);

Jon Henri, West Linn, OR (US);

Assignee:

LAM RESEARCH CORPORATION, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/02 (2006.01); C23C 16/455 (2006.01); C23C 16/50 (2006.01); C23C 16/52 (2006.01); C23C 16/458 (2006.01); C23C 16/46 (2006.01); C23C 16/505 (2006.01); C23C 16/54 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 22/20 (2013.01); C23C 16/4586 (2013.01); C23C 16/45542 (2013.01); C23C 16/45544 (2013.01); C23C 16/46 (2013.01); C23C 16/50 (2013.01); C23C 16/505 (2013.01); C23C 16/52 (2013.01); C23C 16/54 (2013.01); H01L 21/022 (2013.01); H01L 21/0217 (2013.01); H01L 21/0228 (2013.01); H01L 21/02274 (2013.01); H01L 21/67207 (2013.01); H01L 21/67248 (2013.01); H01L 21/67745 (2013.01);
Abstract

Disclosed are methods of and apparatuses and systems for depositing a film in a multi-station deposition apparatus. The methods may include: (a) providing a substrate to a first station of the apparatus, (b) adjusting the temperature of the substrate to a first temperature, (c) depositing a first portion of the material on the substrate while the substrate is at the first temperature in the first station, (d) transferring the substrate to the second station, (e) adjusting the temperature of the substrate to a second temperature, and (f) depositing a second portion of the material on the substrate while the substrate is at the second temperature, such that the first portion and the second portion exhibit different values of a property of the material. The apparatuses and systems may include a multi-station deposition apparatus and a controller having control logic for performing one or more of (a)-(f).


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