The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Jul. 27, 2017
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Takayuki Toshima, Kumamoto, JP;

Shoichi Terada, Kumamoto, JP;

Junji Nakamura, Kumamoto, JP;

Assignee:

Tokyo Electron Limited, Dhahran, SA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 3/10 (2006.01); H01L 21/02 (2006.01); B08B 3/08 (2006.01); H01L 21/67 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0206 (2013.01); B08B 3/08 (2013.01); B08B 3/10 (2013.01); B08B 3/106 (2013.01); H01L 21/02071 (2013.01); H01L 21/31122 (2013.01); H01L 21/6704 (2013.01); H01L 21/67028 (2013.01); H01L 21/67051 (2013.01); H01L 21/67109 (2013.01); H01L 21/67253 (2013.01); H01L 21/31144 (2013.01); H01L 21/32139 (2013.01);
Abstract

The present disclosure relates to a processing liquid supplying unit configured to supply a processing liquid that contains a removing agent of an adhered substance and a solvent having a boiling point lower than a boiling point of the removing agent to a substrate, a substrate heating unit configured to subsequently heat the substrate at a predetermined temperature that is equal to or higher than the boiling point of the solvent in the processing liquid and is lower than the boiling point of the removing agent, and a rinsing liquid supplying unit configured to subsequently supply a rinsing liquid to the substrate so as to remove the adhered substance from the substrate.


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