The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Nov. 20, 2015
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Stilian Ivanov Pandev, Santa Clara, CA (US);

Leonid Poslavsky, Belmont, CA (US);

Dzmitry Sanko, Vallejo, CA (US);

Andrei V. Shchegrov, Campbell, CA (US);

Assignee:

KLA- Tencor Corporation, Milpitas, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 11/06 (2006.01); G01B 11/02 (2006.01); G01B 21/08 (2006.01); H01L 21/66 (2006.01); G01N 21/95 (2006.01); G01N 21/88 (2006.01); G01N 21/64 (2006.01);
U.S. Cl.
CPC ...
G01B 11/06 (2013.01); G01B 11/02 (2013.01); G01B 21/08 (2013.01); H01L 22/12 (2013.01); G01B 2210/44 (2013.01); G01B 2290/45 (2013.01); G01N 21/8806 (2013.01); G01N 21/9501 (2013.01); G01N 2021/6421 (2013.01);
Abstract

Methods and systems for solving measurement models of complex device structures with reduced computational effort are presented. In some embodiments, a measurement signal transformation model is employed to compute transformed measurement signals from coarse measurement signals. The transformed measurement signals more closely approximate a set of measured signals than the coarse measurement signals. However, the coarse set of measured signals are computed with less computational effort than would be required to directly compute measurement signals that closely approximate the set of measured signals. In other embodiments, a measurement signal transformation model is employed to compute transformed measurement signals from actual measured signals. The transformed measurement signals more closely approximate the coarse measurement signals than the actual measured signals. Transformed measurement signals are subsequently used for regression, library generation, or other analyses typically employed as part of an effort to characterize structural, material, and process parameters in semiconductor manufacturing.


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