The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Mar. 24, 2015
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Martin Plihal, Pleasanton, CA (US);

Ankit Jain, Ballston Spa, NY (US);

Michael Lennek, San Jose, CA (US);

Assignee:

KLA—Tencor Corp., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/93 (2006.01); G01N 21/95 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G01N 21/93 (2013.01); G01N 21/9501 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01); G01N 2201/063 (2013.01); G01N 2201/12 (2013.01);
Abstract

Methods and systems for generating defect samples are provided. One method includes identifying a set of defects detected on a wafer having the most diversity in values of at least one defect attribute and generating different tiles for different defects in the set. The tiles define a portion of all values for the at least one attribute of all defects detected on the wafer that are closer to the values for the at least one attribute of their corresponding defects than the values for the at least one attribute of other defects. In addition, the method includes separating the defects on the wafer into sample bins corresponding to the different tiles based on their values of the at least one attribute, randomly selecting defect(s) from each of two or more of the sample bins, and creating a defect sample for the wafer that includes the randomly selected defects.


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