The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Jun. 25, 2018
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Yu-Kuang Liao, Hsinchu, TW;

Cheng-Chun Tsai, Hsinchu, TW;

Chen-Hua Yu, Hsinchu, TW;

Fang-Cheng Chen, Hsin-Chu, TW;

Wen-Chih Chiou, Miaoli County, TW;

Ping-Jung Wu, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); H04B 10/40 (2013.01);
U.S. Cl.
CPC ...
H04B 10/40 (2013.01); G02B 6/428 (2013.01); G02B 6/4283 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01);
Abstract

An optical transceiver including a photonic integrated circuit component, an electric integrated circuit component and an insulating encapsulant is provided. The photonic integrated circuit component includes at least one optical input/output portion configured to transmit and receive optical signal. The electric integrated circuit component is disposed on and electrically connected to the photonic integrated circuit component. The insulating encapsulant covers the at least one optical input/output portion of the photonic integrated circuit component. The insulating encapsulant laterally encapsulates the electric integrated circuit component. The insulating encapsulant is optically transparent to the optical signal.


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