The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

May. 31, 2018
Applicants:

Global Unichip Corporation, Hsinchu, TW;

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chu-Fang Chih, Hsinchu, TW;

Chih-Chieh Liao, Hsinchu, TW;

Chia-Jen Kao, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/673 (2006.01); G08B 5/36 (2006.01); G08B 21/18 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67294 (2013.01); G08B 5/36 (2013.01); G08B 21/18 (2013.01); H01L 21/67376 (2013.01); H01L 21/67383 (2013.01);
Abstract

A wafer shipping device includes a box body having a first slot, a cover body having a second slot, and a sensing circuit module having a first sensor, a second sensor, an indication circuit and a warning device. The first slot and the second slot are used to collaboratively hold a semiconductor wafer. The first sensor and the first sensor are located in the box body for independently sensing whether the semiconductor wafer is inserted in the first slot and the second slot respectively. The indication circuit is electrically connected to the first sensor, the second sensor and the warning device, and correspondingly issued one of types of indication signals to the warning device in response to sensing results obtained from the first sensor and the second sensor respectively.


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