The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Apr. 27, 2017
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Akihiro Kubo, Koshi, JP;

Masahiro Fukuda, Koshi, JP;

Taro Yamamoto, Koshi, JP;

Kenji Yada, Koshi, JP;

Masashi Enomoto, Koshi, JP;

Noboru Nakashima, Koshi, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24D 7/18 (2006.01); B24B 25/00 (2006.01); B24B 27/00 (2006.01); B24B 37/34 (2012.01); B24B 47/16 (2006.01); B24B 49/16 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); B24B 37/005 (2012.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
B24B 37/005 (2013.01); B24B 27/0061 (2013.01); B24B 37/34 (2013.01); B24B 47/16 (2013.01); B24B 49/16 (2013.01); H01L 21/0209 (2013.01); H01L 21/30625 (2013.01); H01L 21/67046 (2013.01); H01L 21/67253 (2013.01); B24B 25/00 (2013.01); B24D 7/18 (2013.01);
Abstract

There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.


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