The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Sep. 26, 2017
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Sheng-Yu Wu, Hsinchu, TW;
Ching-Hui Chen, Hsinchu, TW;
Mirng-Ji Lii, Hsinchu County, TW;
Kai-Di Wu, Tainan, TW;
Chien-Hung Kuo, Tainan, TW;
Chao-Yi Wang, Tainan, TW;
Hon-Lin Huang, Hsinchu, TW;
Zi-Zhong Wang, Tainan, TW;
Chun-Mao Chiu, Kaohsiung, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A semiconductor device includes a semiconductor substrate. A pad region is disposed on the semiconductor substrate. A micro bump is disposed on the pad region. The micro bump has a first portion on the pad region and a second portion on the first portion. The first portion and the second portion have different widths. The first portion has a first width and the second portion has a second width. The first width is larger or smaller than the second width. The micro bump includes nickel and gold. The semiconductor device also includes a passivation layer overlying a portion of the pad region.