The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
Jun. 08, 2017
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Wei Chuang Wu, Tainan, TW;
Ming-Tsong Wang, Taipei, TW;
Feng-Chi Hung, Hsin-Chu County, TW;
Jen-Cheng Liu, Hsin-Chu, TW;
Ching-Chun Wang, Tainan, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
The present disclosure provides a method of manufacturing an image sensor device. The method comprises forming a first semiconductor chip including a matrix of image sensing cells and bonding a second semiconductor chip with the first semiconductor chip. A plurality of conductive vias are formed in the second semiconductor chip, where each of the plurality of conductive vias includes a first end substantially coplanar with a first surface of the first semiconductor chip and a second end in contact with a conductive trace in the second semiconductor chip. A first dielectric layer is formed over the plurality of conductive vias and a first conductive material is formed over the first dielectric layer. The first conductive material is etched to form a plurality of conductors coupled to ground and the plurality of conductors are electrically isolated from one another.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile