The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2019
Filed:
May. 12, 2014
Shin-etsu Handotai Co., Ltd., Tokyo, JP;
Shin-etsu Engineering Co., Ltd, Tokyo, JP;
Hiromasa Hashimoto, Nishigo-mura, JP;
Yasuharu Ariga, Nishigo-mura, JP;
Masanao Sasaki, Nishigo-mura, JP;
Takahiro Matsuda, Annaka, JP;
SHIN-ETSU HANDOTAI CO., LTD., Tokyo, JP;
SHIN-ETSU ENGINEERING CO., LTD, Tokyo, JP;
Abstract
A method of producing a polishing head including: a backing pad, for holding a workpiece back surface, stuck on a lower portion of a rigid body; and a ring template, for holding a workpiece edge, disposed on a lower surface of the backing pad. This polishing head brings a front surface of the workpiece into sliding contact with a polishing pad attached on a turn table while holding the workpiece back surface on the lower surface of the backing pad. The method includes sticking the backing pad on the lower portion of the rigid body with a double-sided tape under a reduced pressure without heating; and sticking the template on the backing pad with a double-sided tape or a liquid or paste reaction curable adhesive containing no solvent under a reduced pressure without heating. This method can polish the workpiece into a very flat workpiece.