The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Mar. 09, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Brandon C. Marin, San Diego, CA (US);

Trina Ghosh Dastidar, Chandler, AZ (US);

Dilan Seneviratne, Chandler, AZ (US);

Yonggang Li, Chandler, AZ (US);

Sirisha Chava, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/10 (2006.01); H01L 23/14 (2006.01); H05K 3/06 (2006.01); H05K 3/18 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/14 (2013.01); H01L 21/4846 (2013.01); H01L 23/145 (2013.01); H01L 23/49822 (2013.01); H01L 23/49866 (2013.01); H05K 3/062 (2013.01); H05K 3/105 (2013.01); H05K 3/185 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01); H05K 3/107 (2013.01); H05K 3/182 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0236 (2013.01); H05K 2203/107 (2013.01);
Abstract

Embodiments of the present disclosure describe selective metallization of an integrated circuit (IC) substrate. In one embodiment, an integrated circuit (IC) substrate may include a dielectric material and metal crystals having a polyhedral shape dispersed in the dielectric material and bonded with a ligand that is to ablate when exposed to laser light such that the metal crystals having the ablated ligand are activated to provide a catalyst for selective electroless deposition of a metal. Other embodiments may be described and/or claimed.


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