The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2019
Filed:
Aug. 31, 2017
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Hung-Li Chiang, Taipei, TW;
I-Sheng Chen, Taipei, TW;
Tzu-Chiang Chen, Hsinchu, TW;
Tung-Ying Lee, Hsinchu, TW;
Szu-Wei Huang, Hsinchu, TW;
Huan-Sheng Wei, Taipei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
Semiconductor device structures are provided. The semiconductor device structure includes a first semiconductor wire over a semiconductor substrate. The first semiconductor wire has a first width and a first thickness. The semiconductor device structure also includes a first gate stack surrounding the first semiconductor wire. The semiconductor device structure further includes a second semiconductor wire over the semiconductor substrate. The first semiconductor wire and the second semiconductor wire include different materials. The second semiconductor wire has a second width and a second thickness. The first width is greater than the second width. The first thickness is less than the second thickness. In addition, the semiconductor device structure includes a second gate stack surrounding the second semiconductor wire.