The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2019
Filed:
Aug. 24, 2016
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Yi-Ying Liu, Hsin-Chu, TW;
Chun-Wen Nieh, Zhubei, TW;
Yu-Sheng Wang, Tainan, TW;
Yu-Ting Lin, Tainan, TW;
Wei-Yu Chen, Zhubei, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/285 (2006.01); H01L 21/321 (2006.01); H01L 29/66 (2006.01); C23C 16/44 (2006.01); H01L 21/324 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/768 (2006.01); H01L 29/45 (2006.01); H01L 29/49 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/665 (2013.01); C23C 16/44 (2013.01); H01L 21/02057 (2013.01); H01L 21/28518 (2013.01); H01L 21/324 (2013.01); H01L 21/3212 (2013.01); H01L 21/67167 (2013.01); H01L 21/67207 (2013.01); H01L 21/68771 (2013.01); H01L 21/7684 (2013.01); H01L 21/76897 (2013.01); H01L 29/45 (2013.01); H01L 29/4966 (2013.01); H01L 29/7833 (2013.01);
Abstract
A method includes placing a wafer in a wafer holder, placing the wafer holder on a loadport of a deposition tool, connecting the wafer holder to a front-end interface unit of the deposition tool, purging the front-end interface unit with nitrogen, and depositing a metal layer on the wafer in the deposition tool.