The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2019

Filed:

Oct. 20, 2015
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Wei-Chih Hsu, Miaoli County, TW;

Kai-Lin Chuang, Chia-Yi, TW;

Yuan-Chi Chien, Taichung, TW;

Jeng-Huei Yang, Taichung, TW;

Jun-Xiu Liu, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 21/306 (2006.01); H01L 21/687 (2006.01); B08B 3/04 (2006.01); B08B 13/00 (2006.01); B08B 17/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02057 (2013.01); B08B 3/04 (2013.01); B08B 13/00 (2013.01); B08B 17/00 (2013.01); H01L 21/30604 (2013.01); H01L 21/67017 (2013.01); H01L 21/67057 (2013.01); H01L 21/67086 (2013.01); H01L 21/68735 (2013.01);
Abstract

An apparatus of processing a semiconductor substrate include a chuck, a holder, a liquid supplying system and a positive pressure unit. The chuck has a principal surface and at least a hole formed thereon. The holder is capable of holding a semiconductor substrate at a position above the principal surface. The liquid supplying system is configured to provide a liquid film onto the principal surface through the hole. The positive pressure unit is configured for providing a gas flow to a space over the chuck. A method of processing a semiconductor substrate is disclosed herein as well.


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