The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Jun. 21, 2017
Applicant:

Mitsui Chemicals, Inc., Minato-ku, Tokyo, JP;

Inventors:

Atsushi Okubo, Tokyo, JP;

Tsuneaki Biyajima, Otake, JP;

Yosuke Ono, Sodegaura, JP;

Kazuo Kohmura, Chiba, JP;

Yasuhisa Fujii, Kyoto, JP;

Nobuko Matsumoto, Kyoto, JP;

Assignee:

MITSUI CHEMICALS, INC., Minato-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 1/62 (2012.01); G03F 1/64 (2012.01); G03F 1/66 (2012.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G03F 1/64 (2013.01); G03F 1/62 (2013.01); G03F 1/66 (2013.01); G03F 7/2004 (2013.01); G03F 7/70983 (2013.01);
Abstract

A pellicle is contaminated with dust or the like for various reasons during the production thereof. Especially, there is a problem that the risk that the dust or the like is attached is high during trimming or various other processes performed on a pellicle film. The present invention provides a method for producing a pellicle for EUV that decreases the attachment of dust or the like. A method for producing a pellicle includes forming a pellicle film on a substrate; trimming the substrate; and removing at least a part of the substrate after trimming the substrate. Before the part of the substrate is removed, at least particles attached to a surface of the pellicle film are removed.


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