The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2019

Filed:

Jul. 24, 2017
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Qun Gao, Clifton Park, NY (US);

Naved Siddiqui, Malta, NY (US);

Anthony I. Chou, Beacon, NY (US);

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 21/8234 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 29/51 (2006.01); H01L 29/10 (2006.01); H01L 29/417 (2006.01); H01L 27/092 (2006.01); H01L 27/088 (2006.01); H01L 27/12 (2006.01); H01L 21/762 (2006.01); H01L 21/8238 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823431 (2013.01); H01L 21/76224 (2013.01); H01L 21/823821 (2013.01); H01L 27/0886 (2013.01); H01L 27/0924 (2013.01); H01L 27/1211 (2013.01); H01L 29/1083 (2013.01); H01L 29/41791 (2013.01); H01L 29/516 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01); H01L 29/7846 (2013.01); H01L 29/7849 (2013.01);
Abstract

One illustrative method disclosed herein includes, among other things, forming a conformal piezoelectric material liner layer on at least the opposing lateral sidewalls of a fin, forming a recessed layer of insulating material on opposite sides of the fin and on the conformal piezoelectric material liner layer, removing portions of the conformal piezoelectric material liner layer positioned above the recessed layer of insulating material to thereby expose a portion of the fin above the recessed upper surface, and forming a gate structure above the recessed layer of insulating material and around a portion of the fin positioned above the recessed upper surface.


Find Patent Forward Citations

Loading…