The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2019

Filed:

Oct. 24, 2014
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Clinton P. Sakata, San Jose, CA (US);

Hui Chen, Burlingame, CA (US);

Jim K. Atkinson, Los Gatos, CA (US);

Brian J. Brown, Palo Alto, CA (US);

Jianshe Tang, San Jose, CA (US);

Yufei Chen, Cupertino, CA (US);

Yunshuang Ding, Fremont, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/67 (2006.01); B08B 1/00 (2006.01); B08B 1/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67046 (2013.01); B08B 1/006 (2013.01); B08B 1/04 (2013.01);
Abstract

In some embodiments, an apparatus for cleaning a substrate is provided that includes (1) a substrate chuck configured to support a substrate with a front side of the substrate accessible; (2) a buff pad assembly configured to support a buff pad having a diameter smaller than a diameter of the substrate; and (3) a swing arm coupled to the buff pad and configured to position and rotate the buff pad along the front side of the substrate, and control an amount of force applied by the buff pad against the front side of the substrate during cleaning. The substrate chuck, buff pad assembly and swing arm are configured to buff clean the substrate. Numerous additional aspects are disclosed.


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